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Home / Tag Archives: advanced semiconductor packaging fiscal support

Tag Archives: advanced semiconductor packaging fiscal support

India Semiconductor Mission 2.0: Union Cabinet Approves ₹1.27 Lakh Crore Outlay to Build a Global Microchip Powerhouse

Infographic outlining the 6 pillars of India Semiconductor Mission 2.0, highlighting the ₹1.27 lakh crore outlay and fiscal support breakdown for chip fabs, advanced packaging, and supply chain materials.

New Delhi. Wednesday, 15 July 2026 In a historic move to secure technological sovereignty and firmly integrate into the global electronics supply network, the Union Cabinet, chaired by Prime Minister Narendra Modi, officially approved India Semiconductor Mission (ISM) 2.0. Carrying a massive financial layout of ₹1.27 lakh crore ($15.2 billion …