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Home / Tag Archives: domestic chip packaging materials localized

Tag Archives: domestic chip packaging materials localized

Beyond the Fabs: Deconstructing India’s High-Stakes Upstream Semiconductor Race

A high-tech cleanroom facility displaying an automated robotic arm handling an ultra-pure 300mm silicon wafer under soft yellow lithography lighting.

Mumbai. Sunday, 19 July 2026 India’s bold transition from a global chip design powerhouse into a comprehensive physical manufacturing giant has officially crossed into its next critical phase under the structured backing of the India Semiconductor Mission (ISM) and the newly active Semicon 2.0 framework. While capital subsidies and multi-billion-dollar …